Skylake Delidding, Changing Stock Thermal Compounds Give Better Thermals?

Japanese Publication PC Watch has delidded Core i7 6700k Skylake CPU and revealed a smaller CPU die and a thinner IHS, than previous generation CPUs.

The Intel’s new Skylake CPU build by 14nm FinFET process, same as previous generation Broadwell.  Despite being on the same the delidding revealed that the new core i7 6700k die is significantly smaller than Broadwell based i7 5775C, which is basically down to the coordinated GPU inside of the Skylake chip itself. The broadwell based 5775C has more than 2x the GPU execution units as it’s Skylake proportional, 48 contrasted with 24, and has a 128MB SRAM Cache for the iGPU.

With Skylake the IHS is only 0.8m thick, compared to Haswell which is 1.1mm thick. But Skylake does use a thicker IHS (integrated heatspreader), that means there should be no compatibility problems with old socket 1150/1151 coolers.

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PC Watch tried the CPU with different thermal compounds and compared it with the temperatures of the stock CPU. Testing was directed utilizing Cryorig R1 Ultimate cooler and was tried at stock rates and overclock @ 4.6GHz at 1.325V on an ASUS Z170-A motherboard. The thermal compounds which was used are stock TIM, Prolimatech PK-3 and Cool Laboratory Pro thermal compounds.

The Cool Laboratory TIM has the most significant result in thermals, with the CPU temp down from 74 degrees to 58 degrees at stock clock speed and 88 degrees to 68 degrees with overclocking of 4.6GHz. These results showing us that Intel’s thermal solution is simply not even close at stock its 16 degree and with overclock 20 degrees which is a huge difference. For the price its very unexpected when Intel charging a premium price for this processors and which supposed to be overclocked.