Details on Intel’s upcoming Skylake-X and Kaby Lake-X processors with LGA2066 Platform

Intel’s next high-end desktop (HEDT) platform which will succeed the current “Broadwell-E” LGA2011v3, the new CPU will be the X-series “Basin Falls” platform. The X-series consists of the “Skylake-X” and “Kaby Lake-X” processors, and a chipset derived from Intel’s upcoming 200-series. Intel brings new sockets for X-series, the LGA2066.

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The new “Skylake-X” and “Kaby Lake-X” will be multi-core processors with-out integrated graphics, with double the memory bandwidth and up to triple the PCIe lanes compare to Skylake Core i7-6700 processors. In an unusual move, Intel will launch both “Skylake-X” and “Kaby Lake-X” together. With “Skylake-X” coming in 6-core, 8-core, and 10-core variants; while the “Kaby Lake-X” will initially only be offered in quad-core. The “Kaby Lake-X” CPU will only feature a dual-channel memory bus, and with this CPU half of the DDR4 DIMM slots disabled on the LGA2066 motherboard and also have fewer PCIe lanes.

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On the other hand, the Core i7 “Skylake-X” processors, will feature 6-core, 8-core, and 10-core variants with all chips featuring quad-channel memory interfaces. Besides the DMI 3.0 (PCI-Express 3.0 x4 physical layer) chipset bus, “Skylake-X” chips will offer up to 44 PCI-Express Gen 3.0 lanes. Interestingly, the chipset will have a much wider downstream PCIe lane budget than Intel’s previous platform from past several generations – with offers a whopping 22 more PCI-Express Gen 3.0 downstream lanes. This means the new platform will have enough PCI-E lanes for driving high bandwidth onboard devices such as Thunderbolt controllers, multiple PCI-Express SSDs, or four cards with 8x PCI-Express Gen 3.0 lanes each.

As of now Intel plans to launch the Core i7 “Skylake-X” processors in early Q3-2017 (July-September 2017).

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